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iWave iW-RainboW-G36M

Komputer modułowy iW-RainboW-G36M Zynq UltraScale+ MPSoC ZU5/ZU4/ZU3T/ZU3/ZU2/ZU1 SOM

iWave iW-RainboW-G36M

  • AMD Xilinx’s ZU5/ZU4/ZU3T/ZU3/ZU2/ZU1 Compatible Zynq Ultrascale+ MPSoC SoM
  • 64bit, 2GB PS DDR4 RAM (Upgradable)
  • 16 bit, 2GB PL DDR4 RAM (Upgradable)
  • 4 High-Speed Transceiver lanes (Up to 12.5Gb/s)
  • 16GB eMMC Flash (Upgradable)
  • On-SOM Gigabit Ethernet PHY & USB2.0 transceiver
  • RGMII Interface or ULPI Interface x 1

SKU: iW-RainboW-G36M Zynq UltraScale+ MPSoC ZU5/ZU4/ZU3T/ZU3/ZU2/ZU1 SOM

Description

Karta katalogowa Manual

On Board Features:

ZU5/ZU4/ZU3T/ZU3/ZU2/ZU1 – Zynq Ultrascale+ MPSoC (SFVC784) Processing System (PS/Processor)

  • Quad-core Arm Cortex-A53 MPCore @1.5GHz, Dual-core Arm Cortex-R5 MPCore @600MHz
  • Arm Mali-400MP2 GPU @677MHz

Programming Logic (PL/FPGA)

  • Up to 256.2K Logic cells & 117.12K LUTs
  • High Speed GTH Transceiver Lanes x 4 (Up to 12.5Gb/s)

 
RAM Memory Processing System (PS):

  • 64bit, 2GB DDR4 RAM with ECC

Programmable Logic (PL/FPGA):

  • 16bit, 2GB DDR4 RAM

 
On Board Flash
  • 256MB QSPI Flash for boot & storage
  • 16GB eMMC Flash for boot & storage (Expandable up to 128GB)
  • EEPROM (4Kbit)

 

240pin High-Speed High-Density Board to Board Connector 1 Interfaces:

  • PS GTR Transceiver Lanes x 4 (Up to 6.0Gb/s)
  • HP Bank IOs – Up to 481 LVDS/96 Single Ended (SE)
  • HD Bank IOs – Up to 24 LVDS / 48SE
  • ADC Input pins – Up to 32 Differential/Single Ended from HP Banks
  • ADC Input pins – Up to 16 Differential/Single Ended from HD Banks
  • System Synchronization Differential Clock Output/Input

240pin High-Speed High-Density Board to Board Connector 2 Interfaces:

From PS Block
  • GEM3 RGMII Interface or ULPI Interface x 1
  • Gigabit Ethernet x 1 Port (through On SOM Gigabit Ethernet PHY)
  • USB2.0 OTG x 1 Port (through On-SOM USB2.0 transceiver)
  • SD (4bit) x 1
  • Debug UART & Data UART x 1
  • I2C x 2 Port
  • CAN Interface x 22
  • JTAG x 1

 
From PL Block
  • High Speed GTH Transceiver Lanes x 4 (Up to 12.5Gbps)
  • HD Bank IOs – 17 LVDS/36 Single Ended
  • GC Inputs – 6 Differential/Single Ended
  • ADC Input Pins – Up to 17 Differential/Single Ended from HD Banks
  • SPI with (2CS) x 1
  • 1PPS In/Out

Other On-Board Features

  • Trusted Platform Module 2.0 (TPM)
  • Fan Header
  • USB 2.0 PHY
  • Gigabit Ethernet PHY
  • 10-Bit Clock Synthesizer

OS Support

  • Linux BSP – Petalinux/vivado 2023.1
  • Baremetal BSP – Vivado 2023.1

General Features:

Power Input +5VDC +/- 5% Input from Board-to-Board Connector 2
Form Factor 50mm X 60mm (REN)
Operating Temperature -40°C to +85°C (Industrial)
Environment Specification RoHS & REACH Compliant
Compliance CE*

Notes:
*Under Progress
1 2 PL IOs can be used as PL PCIe reset functionality or PL DIFF/SE in Board-to-board connector.
2 CAN0 is available when feedback clock functionality in QSPI Flash is not using.

DEVELOPMENT KIT

  • FMC+ High Serial Pin Count (HSPC) Connector
  • Debug UART and JTAG through USB Type-C
  • Dual 1GBE Ethernet through RJ45
  • USB2.0 OTG interface through USB Type-C Connector
  • PCIe x1/x2/x4 Gen2 Connector
  • USB 3.0 Connector
  • DP  & M.2 SATA Connector
  • Micro SD & PMOD Connector
  • RTC Coin Cell Holder
  • Header for UART, CAN, SPI and GPIOs
  • Form Factor: 120mm x 120mm
  • Dual PMOD Connector
  • RTC Coil Cell holder
  • Operating Temperature: -20°C to +85°C
  • Form Factor : 140mm x 170mm
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