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iWave iW-RainboW-G45M Stratix 10 SoC FPGA SOM

iWave iW-RainboW-G45M Stratix 10 SoC FPGA SOM

iWave iW-RainboW-G45M Stratix 10 SoC FPGA SOM

  • Intel’s Stratix 10 SoC & FPGA compatibility with F1760 Package
    • SX SoC FGPA – SX850, SX1100, SX1650, SX2100, SX2500 & SX2800
    • GX FPGA – GX850, GX1100, GX1650, GX2100, GX2500 & GX2800
  • 8GB DDR4 for HPS with ECC (64bit + 8bit) (Upgradable)
  • 2 x 8GB DDR4 for FPGA (64bit + 64bit) (Upgradable)
  • Upto 16 GXT Transceiver Channels up to 28.3Gbps
  • 32 GX Transceiver Channels up to 17.4Gbps
  • More than 100 LVDS IOs available through B2B Connectors.
  • On SOM Clock Synthesizer
  • Industrial Grade availability
  • 10+ years of Product Longevity Program

SKU: iWave iW-RainboW-G45M Stratix 10 SoC FPGA SOM

Description

Karta katalogowa Manual

On Module Feature:

CPU Supported CPU Devices

  • Compatible Stratix 10 SX SoC FPGA Family-SX850, SX1100, SX1650, SX2100, SX2500, SX2800 variants support.
    • Quad-Core 64bit ARM Cortex -A53 with MPU up to 1500MHz
    • Up to 2753K Logic Elements & 9,33,120 ALMs
    • High Speed Transceivers x48 up to 28.3Gbps
  • Compatible Stratix 10 GX FPGA Family – GX850, GX1100, GX1650, GX2100, GX2500, GX2800 variants support.
    • Up to 2753K Logic Elements & 9,33,120 ALMs
    • High Speed Transceivers x48 up to 28.3Gbps
Memory & Storage
  • 32GB eMMC Flash (Upgradable).
  • 1Gb QSPI Flash (Upgradable).
  • 8GB DDR4 for HPS with ECC (64bit + 8bit) (Upgradable)
  • 2 x 8GB DDR4 for FPGA (64bit + 64bit) (Upgradable)
Other
  • Gigabit Ethernet PHY for HPS
  • USB2.0 OTG Transceiver for HPS
  • JTAG/ Active Serial Header
  • Fan Header

Board to Board Connector1 Interfaces(240pin):

From FPGA Block
  • 16 GX/GXT Transceiver Channels up to 21Gbps1
  • FPGA IOs
    • 43 LVDS IOs/93 Single ended (SE)
    • 3 General Purpose Clock Input LVDS Pair/Single Ended
    • 4 General Purpose Clock Output LVDS Pair/Single Ended

Board to Board Connector2 Interfaces(240pin):

From HPS & SDM Blocks
  • Gigabit Ethernet x 1 Port
  • USB2.0 OTG x 1 Port
  • UART x 1 Port
  • I2C x 1 Port
  • Debug UART x 1 Port
  • JTAG x 1 Port from SDM
  • SPI x 1 Port from SDM (Optional)
  • SPI Slave x 1 Port (Optional)
  • SDMMC x 1 Port (Optional)
From FPGA Block
  • 8 GX/GXT Transceiver Channels up to 21Gbps1
  • FPGA IOs
    • 48 LVDS IOs/96 Single ended (SE)
    • 4 General Purpose Clock Input LVDS Pair/Single Ended
    • 4 General Purpose Clock Output LVDS Pair/Single Ended

Board to Board Connector3 Interfaces(240pin):

From FPGA Block
  • 24 GX/GXT Transceiver Channels up to 28.3Gbps

Board to Board Connector4 Interfaces(80pin):

From FPGA Block
  • FPGA IOs
    • 20 LVDS IOs/42 Single ended (SE)

General Features:

Power Input 5V through B2B Connector
Form Factor 110mm x 75mm
BSP Support Linux
Operating Temperature -40°C to +85°C
Environment Specification REACH & RoHS3 Compliant
Note: 1 GXT Transceivers speed capped to 21Gbps due to connector limitation.

DEVELOPMENT KIT

  • QSFP28/QSFP+ Connector
  • 112G FireFly Connector
  • 10G Ethernet through SFP+ Connector
  • 12G SDI Video IN through HD BNC Connector
  • 12G SDI Video OUT through HD BNC Connector
  • 4K HDMI 2.0 IN through HDMI Connector
  • 4K HDMI 2.0 OUT through HDMI Connector
  • Dual FMC High Pin Count (HPC) Connector
  • DP 1.2a Display Port Connector
  • M.2 SATA 3.1 Connector
  • USB 3.0 OTG through TypeC Connector (Optional)
  • Gigabit Ethernet through RJ45MagJack
  • USB2.0 OTG through MicroAB Connector
  • Standard SD Connector (Optional)
  • 20 Pin Header (for HPS IOs)
  • Dual PMOD Connector
  • Operating Temperature: -20°C to +85°C
  • Form Factor : 140mm x 170mm
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