Description
Opis
Komputer modułowy standardu SMARC® (Rev. 2.1) oparty na procesorach Intel Atom® serii x7000E, Intel® Core™ i3 oraz Intel® serii N (nazwa kodowa Alder Lake-N).
 Description |
SMARC® Rel. 2.1 compliant module with Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N) |
|---|---|
 Cpu |
Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor and Intel® Processors N Series (Codename: Alder Lake N):
· Intel® Atom® x7213E, 2 Cores @1.7 GHz (3.2 GHz Turbo), 10W TDP, with TSN and TCC* · Intel® Atom® x7425E, 4 Cores @1.5 GHz (3.4 GHz Turbo), 12W TDP, with TSN and TCC* · Intel® Atom® x7211E, 2 Cores @1.0 GHz (3.2 GHz Turbo), 6W TDP, with TSN and TCC* · Intel® Core™ i3-N305, 8 Cores @1.8 GHz (3.8 GHz Turbo), 15W TDP · Intel® Processor N200, 4 Cores @1.0 GHz (3.7 GHz Turbo), 6W TDP · Intel® Processor N97, 4 Cores @2.0 GHz (3.6 GHz Turbo), 12W TDP · Intel® Processor N50, 2 Cores @1 GHz (3.4 GHz Turbo), 6W TDP * Time Sensitive Network and Time Coordinate Computing |
| Memory |
Up to 16GB LPDDR5-4800 soldered down memory with IBECC (in-band error correction code) |
 Graphics |
Integrated Intel® UHD Graphics driven by Intel® Xe architecture:
AVX256 & VNNI support for faster AI inference and media transcoding Support with up to 3 independent 4K60 SDR displays |
 Video Interfaces |
Integrated Intel® UHD Graphics driven by Intel® Xe architecture, supporting 3 independent displays each up to 4K resolution |
 Video Resolution |
Up to 4096×2160 @60Hz |
 Mass Storage |
1x external S-ATA Gen3.2 channel
Optional eMMC 5.1 drive soldered on-board |
 Networking |
2x NBase-T Ethernet ports (2.5GbE supported) with Time-Sensitive Networking functionality, implemented using as many Intel® i225 Gigabit Ethernet controllers, managed by two integrated PCH PCI-e ports
Optional SERDES (SGMII) interface for additional third Gigabit Ethernet (factory option, alternative to fourth PCI-e lane) |
 Usb |
6x USB 2.0 host ports
2x USB 3.2 Gen2 ports |
| Pci |
4x PCIe Gen3 lanes
Possible channel aggregations:
|
 Audio |
HD Audio and Soundwire/i2S Audio interfaces |
 Serial Ports |
2x UARTs
2x HS-UARTs |
 Other Interfaces |
Up to 14x GPIOs
SM bus I2C bus 1x SPI interface for boot 1x General Purpose SPI or eSPI (factory alternatives) Power management signals, watchdog |
 Power Supply |
+5VDC and +3VDC for RTC |
 Operating System |
Microsoft® Windows 10
Linux Kernel LTS |
 Operating Temperature |
0°C to +60°C (Commercial version) *
*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature depends on the application, enclosure, and/or environment. It is the customer’s responsibility to implement an application-specific cooling solution for the customer’s system that keeps the heat spreader temperature in the range indicated. |
 Dimensions |
50 x 82 mm |
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