Description
Opis
SECO SOM-COM-HPC-A-TGL-H (LAGOON / CHPC-D57-CSA) to komputer modułowy COM-HPC® typu Client w rozmiarze A do zastosowań FuSa, oparty na procesorach Intel® Xeon® W-11000E, Core™ vPro® i Celeron® 11. generacji (Tiger Lake-H).
 Description |
COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (formerly Tiger Lake-H) Processors for FuSa applications |
|---|---|
 Cpu |
11th Generation Intel® Xeon®, Core™ and Celeron® Processors, also available in industrial temperature range. • Intel® Core™ vPRO® i7-11850HE, Eight Core @ 2.6GHz (up to 4.7GHz in Turbo Boost) with HT, 24MB Cache L3, 45/35W cTDP • Intel® Core™ vPRO® i5-11500HE, Six Core @ 2.6GHz (up to 4.5GHz in Turbo Boost) with HT, 12MB L3 Cache, 45/35W cTDP • Intel® Core™ i3-11100HE, Quad Core @ 2.4GHz (up to 4.4GHz in Turbo Boost) with HT, 8MB L3 Cache, 45/35W cTDP • Intel® Celeron® 6600HE, Dual Core @2.6GHz, 8MB L3 Cache, 35W TDP • Intel® Xeon® vPRO® W-11865MRE, Eight Core @ 2.6GHz (up to 4.7GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC, TCC/TSN and Functional Safety Essential Design package, 45/35W cTDP – Industrial (w/ Turbo OFF) • Intel® Xeon® vPRO® W-11555MRE, Six Core @ 2.6GHz (up to 4.5GHz in Turbo Boost) with HT, 12MB L3 Cache, with ECC, TCC/TSN and Functional Safety Essential Design package, 45/35W cTDP – Industrial (w/ Turbo OFF) • Intel® Xeon® W-11155MRE, Quad Core @ 2.4GHz (up to 4.4GHz in Turbo Boost) with HT, 8MB L3 Cache, with ECC and TCC/TSN, 45/35W cTDP – Industrial (w/ Turbo OFF) • Intel® Xeon® vPRO® W-11865MLE, Eight Core @ 1.5GHz (up to 4.5GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP • Intel® Xeon® vPRO® W-11555MLE, Six Core @ 1.9GHz (up to 4.4GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP • Intel® Xeon® W-11155MLE, Quad Core @ 1.8GHz (up to 3.1GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP B Cache, 28/15/12W cTDP – Industrial (w/ Turbo OFF) |
| Max Cores |
8 |
| Memory |
2x DDR4-3200 SODIMM Slots with ECC (In-Band Error Correction Code), up to 64GB supported |
 Graphics |
Integrated Iris Xe Graphics Core Gen12 architecture, with up to 32 Execution Units and up to 2 VDbox MPEG2, WMV9, AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP9, AV1 HW decoding, up to 8k60. AVC/H.264, HEVC/H.265, JPEG, VP9 HW encoding, up to 8k30 Support up to 4 independent displays. |
 Video Interfaces |
1x eDP 1.4b or MIPI_DSI 1.3 Up to 3x DP++ interface, supporting Display Port 1.4a and HDMI 2.0b Up to 2x Display Port over Type-C (Alternate mode) |
 Video Resolution |
DP, eDP: Up to 5120×3200 @60Hz 24bpp / 7680×4320@60Hz 30bpp with DSCMIPI-DSI: Up to 3200×2000 @60Hz 24bpp, 5120×3200 @60Hz 24bpp with DSCHDMI 1.4: Up to 4Kx2K 24-30Hz 24bppHDMI 2.0b: Up to 4Kx2K 48-60Hz 24bpp / 4Kx2K 48- 60Hz 12bpc (need dedicated redriver on carrier board) |
 Mass Storage |
2 x S-ATA Gen3 Channels PCI-e x4 port can be used to connect, on the carrier board, M.2 NVMe drives |
 Networking |
Up to 2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet connection, managed by as many Intel® i225 2.5GbE Controllers with TSN |
 Usb |
2x USB4 ports 2x USB 3.2 Gen 2×2 ports 8 x USB 2.0 Host ports |
| Pci |
1x PCI-e x4 Gen 4 port for NVME 16x PCI-e Gen4 lanes, can be used to support 1x PCI-e x16, 2x PCI-e x8 or (1x PCI-e x8 +2x PCI-e x4) root ports 20x PCI-e Gen 3 lanes, groupable to support up to 12 root ports, max allowed grouping PCI-e x4 |
 Audio |
SoundWire and I2S Audio Interface |
 Serial Ports |
2x legacy UARTs, managed by the Embedded Controller |
 Other Interfaces |
2x 4-lane CSI-2 interfaces, optional SPI, eSPI, SM Bus, 2x I2C, Watchdog timer, Carrier board FAN Control Management signals, ACPI signals, Safety Status signals Deep Sleep / Battery support Optional TPM 2.0 module on-board 12x GPIOs |
 Power Supply |
+8VDC .. +20VDC Main power supply +5V stand-by |
 Operating System |
Windows 10 IoT Enterprise LTSC Linux Kernel LTS Yocto Project 3.0 WindRiver VxWorks 7.0 Android |
 Operating Temperature |
0°C ÷ +60°C (Commercial version) -40°C ÷ +85°C (Industrial Range) |
 Dimensions |
120 x 95 mm (COM-HPC® Size A Form factor, Client pinout) |
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