Description
Opis
SECO CALLISTO to komputer modułowy standardu COM Express® Basic (Rev. 3.1) w formacie Basic Type 6 oparty na procesorach Intel® Core™ 13 generacji Raptor Lake-P.
 Description |
COM Express® 3.1 Type 6 Basic Module with 13th Gen Intel® Processors (Raptor Lake-P) |
|---|---|
 Cpu |
13th Generation Intel® Processors (Raptor Lake-P)
|
| Memory |
Two DDR5 SO-DIMM slots supporting DDR5-4800, IBECC modules memory, up to 64GB |
 Graphics |
Integrated Gen12 UHD Graphics
Improved image (IPU6EP) and video processing (AV1/GNA 3.0) Support up to 4 independent displays @ 4K |
 Video Interfaces |
Up to 3x Digital Display Interfaces (DDIs), supporting DVI, DP 1.4, HDMI 2.1
1x VGA (factory option) 1x eDP 1.3 or single/dual-channel 18-/24-bit LVDS interface (factory alternatives) |
 Video Resolution |
HDMI and DP up to 8K @ 60Hz via TCSS with Hayden Bridge
eDP 1.4b up to 5K @ 120Hz (HBR3 with VDSC1.1) LVDS up to 1920×1200 @ 60Hz |
 Mass Storage |
2x SATA Gen3 channels
Up to 128 GB on-board NVMe SSD (factory alternative to one PCI-express Graphics (PEG) x4 Gen4) |
 Networking |
1x NBase-T Ethernet interface with Intel® I225 GbE controller, with TSN and 2.5GbE supported. |
 Usb |
Up to 2x USB 4 Gen2 host ports (depending on carrier board retimer implementation)
4x USB 3.2 Gen2 (10Gbps) host ports (depending on carrier board retimer implementation) 8x USB 2.0 host ports |
| Pci |
Up to 8x PCI-e x1 Gen3 lanes
1x PCI-express Graphics (PEG) x8 Gen4 Up to 2x PCI-express Graphics (PEG) x4 Gen4 |
 Audio |
HD audio and Soundwire/i2S audio interfaces |
 Serial Ports |
2x UARTs |
 Other Interfaces |
SPI, I2C, SM Bus, Thermal Management, FAN management
Optional eSPI or LPC bus (factory alternatives) Optional TPM 2.0 on-board LID#/SLEEP#/PWRBTN#, Watchdog 4 x GPI, 4 x GPO |
 Power Supply |
+12VDC ± 10%, +5VSB (optional), +3VRTC (optional) |
 Operating System |
Microsoft® Windows 10
Linux Ubuntu |
 Operating Temperature |
0°C to +60°C (commercial version)*
-40°C to +85°C (industrial version)*
*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
 Dimensions |
125 x 95 mm (COM Express® Basic Form factor, Type 6 pinout) |
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